E. R.J. Edwards, Guohan Hu, et al.
IEDM 2020
Recent advances in semiconductor and packaging technologies have accelerated the miniaturization of portable sensing devices including visible-domain cameras, IR cameras, and millimeter-wave (mmWave) radars. Simultaneously, image and sensor data processing capabilities based on Systems-on-Chip (SoCs) have evolved as well to the extent toward the goal of implementing learning-based automatic recognition capabilities. This paper discusses the challenges and opportunities associated with the vertical sensors-to-software integration of portable systems capable of performing multi-spectral imaging, where data from different portions of the EM spectrum is captured, processed, and displayed simultaneously. An example hardware implementation, multi-spectral image data, and potential applications are discussed
E. R.J. Edwards, Guohan Hu, et al.
IEDM 2020
Lin Dong, Steven Hung, et al.
VLSI Technology 2021
Pritish Parida
DCD Connect NY 2025
Akihiro Horibe, Yoichi Taira, et al.
IEDM 2025