ReviewElectromigration and reliability in submicron metallization and multilevel interconnectionThomas KwokMaterials Chemistry and Physics
PaperNew leakage mechanism in sub-5-nm oxynitride dielectricsTue Nguyen, Daniel A. Carl, et al.Applied Physics Letters
PaperComputer simulation of vacancy migration in a fcc tilt boundaryThomas Kwok, Paul S. Ho, et al.Surface Science
Workshop paperAn enterprise electronic contract management system using dual XML and secure PDF documentsThomas Kwok, Thao NguyenEDOC 2006