NanoStack Transistor Architecture for CMOS 7A Node and Beyond
Shay Reboh, Chen Zhang, et al.
VLSI Technology and Circuits 2025
The endurance performance of a novel confined phase change memory cell with metallic nitride liner is investigated using a transmission electron microscope (TEM). Write endurance has been shown to be substantially improved by this new structure [1]. Memory cells that had been cycled up to 109 were crosssectioned and studied using the TEM. A majority of the electrically observed endurance failure mechanisms were stuck-SET. Physical failure analysis showed the failed cell is always associated with large void formation and material segregation. In-situ TEM analysis was used to study the void formation, accumulation and movement, where the memory cell was simultaneously operated and imaged in the TEM. Also, an interesting self-healing process of the void was recorded during the set/reset operation.
Shay Reboh, Chen Zhang, et al.
VLSI Technology and Circuits 2025
Yu Gyeong Kang, Masatoshi Ishii, et al.
Advanced Science
S.C. Lai, S. Kim, et al.
VLSI Technology 2013
Santanu Bag, Oki Gunawan, et al.
Energy and Environmental Science