Conference paper
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
IBM Telum II is an 8 core 5.5 GHz microprocessor for the zNext system. Key capacity and performance improvements are achieved through enhancements to the core, AI accelerator, and the use of high-density SRAM cell to increase cache size. A new on-chip data processing unit is included with an initial use of IO acceleration. Telum II maintains high reliability and a power profile within 5% of the prior generation while simultaneously increasing frequency and increasing latch count by 40%.
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Marcelo Amaral
OSSEU 2023
Evaline Ju, Kelly Abuelsaad
KubeCon EU 2026
Ilias Iliadis
International Journal On Advances In Networks And Services