Conference paperThree-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomographyP.A. Ercius, D.A. Muller, et al.M&M 2006
Conference paperA study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH zC.-K. Hu, D. Canaperi, et al.AMC 2003
Conference paperMechanisms for microstructure evolution in electroplated copper thin filmsJ.M.E. Harper, C. Cabral Jr., et al.MRS Spring Meeting 1999
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
