L. Gignac, M. Kawasaki, et al.
Journal of Applied Physics
Paper
High energy BSE/SE/STEM imaging of 8 um thick semiconductor interconnects
Abstract
No abstract available.
Related
Conference paper
Electromigration reliability of advanced interconnects
C.-K. Hu, L. Gignac, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2007
S. Bangsaruntip, G.M. Cohen, et al.
IEDM 2009
E. Liniger, L. Gignac, et al.
Journal of Applied Physics