Zohar Feldman, Avishai Mandelbaum
WSC 2010
IBM thin-film tape heads have evolved from the ferrite-based heads first used in the IBM Model 3480 Tape Drive to the hard-disk-drive (HDD) technology flat-profile heads used in IBM Linear Tape-Open® (LTO®) products. This paper describes that transition and discusses the flat tape head manufacturing processes, drive implementation, performance, and outlook. Thin-film head technology for hard-disk drives was first used in tape heads in the early 1990s, when IBM built quarter-inch cartridge head images on HDD-type wafers. This was a springboard for the next step, flat-lapped tape heads, which use not only HDD wafers, but also HDD post-wafer machining technologies. With the emergence of LTO, flat heads entered mainstream tape head production in IBM. These have proven to have high performance and durability.
Zohar Feldman, Avishai Mandelbaum
WSC 2010
Renu Tewari, Richard P. King, et al.
IS&T/SPIE Electronic Imaging 1996
Sai Zeng, Angran Xiao, et al.
CAD Computer Aided Design
György E. Révész
Theoretical Computer Science