O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
Grain growth in vapor-deposited 81 at.% Ni+19 at.% Fe thin films 200 and 400 Å thick in the temperature range 350°-450°C has been investigated by transmission electron microscopy. The results have been interpreted in terms of a previously published model of grain growth in thin films on substrates. The activation energy for grain growth in this alloy has been determined as 1.7±0.2 eV. © 1974.
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
P.C. Pattnaik, D.M. Newns
Physical Review B
J.C. Marinace
JES
J.Z. Sun
Journal of Applied Physics