A. Davidson, B. Dueholm, et al.
Physical Review Letters
Paper
Flip-chip bonding with solder dipping
Abstract
We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.
Related
A. Davidson, N.F. Pedersen, et al.
Applied Physics Letters
J. Holm, Paola Barbara, et al.
Physica D: Nonlinear Phenomena
D.J. Frank, M.J. Brady, et al.
IEEE Transactions on Magnetics