Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Paper(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic SimulationsDipanjan Gope, Albert E. Ruehli, et al.IEEE T-MTT
Conference paperInvestigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cablesAndreas C. Cangellaris, Karen M. Coperich, et al.EMC 2001
PaperVortex dynamics in YBaCuO single crystals with point- and line-like defects-flux creep studiesJ.R. Thompson, Yang Ren Sun, et al.Physica A: Statistical Mechanics and its Applications