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SPIE Advanced Lithography 2010
This letter describes a novel equivalent circuit model extraction approach for flip-chip ball interconnects based on a direct probing techniques. The derived model has been verified up to 40 GHz. © 2005 IEEE.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
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INFORMS 2021
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Semiconductor Science and Technology
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SPIE Optical Engineering + Applications 2009