Icko Eric Timothy Iben
EOS/ESD 2009
Wire-bonding equipment is essential to modern electronics manufacturing lines. Equipment, such as motors, either from components within or external to the wire-bonder can generate EMI. This is a study of EMI on a wire-bonder, determining the EOS levels, the potential for damage to sensitive electronics devices and means of eliminating the unwanted EMI.
Icko Eric Timothy Iben
EOS/ESD 2009
Icko Eric Timothy Iben, Stanley Czarnecki, et al.
EOS/ESD 2007
Icko Eric Timothy Iben
EOS/ESD 2019
Icko Eric Timothy Iben, Dylan Boday, et al.
EOS/ESD 2012