R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
Grain boundary electrotransport of copper and silver atoms in copper + 1·2 at.% silver thin film conductors has been found to take place in opposite directions; the copper atoms migrate against the direction of electron flow, while the silver atoms migrate along this direction. It is shown that both the transport directions of the copper and the silver atoms can be qualitatively interpreted in terms of the existing theories of electromigration. © 1974 Peragamon Press.
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
P. Alnot, D.J. Auerbach, et al.
Surface Science
Julien Autebert, Aditya Kashyap, et al.
Langmuir