E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
Grain boundary electrotransport of copper and silver atoms in copper + 1·2 at.% silver thin film conductors has been found to take place in opposite directions; the copper atoms migrate against the direction of electron flow, while the silver atoms migrate along this direction. It is shown that both the transport directions of the copper and the silver atoms can be qualitatively interpreted in terms of the existing theories of electromigration. © 1974 Peragamon Press.
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
Kenneth R. Carter, Robert D. Miller, et al.
Macromolecules
Fernando Marianno, Wang Zhou, et al.
INFORMS 2021
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009