Conference paper
Detailed electrical analysis of a benchmark MCM structure
Barry J. Rubin, W.D. Becker
IEEE Topical Meeting EPEPS 2000
In this paper we discuss the electrical and physical properties of interconnection structures that impact the performance of computer systems. These considerations are illustrated with three examples of such devices found in a typical mainframe. The requirements for the future are then presented. The ability of new technologies, electrical and optical, for satisfying these requirements is discussed. © Taylor & Francis Group, LLC.
Barry J. Rubin, W.D. Becker
IEEE Topical Meeting EPEPS 2000
G. Arjavalingam, Michael A. Russak, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
I.M. Elfadel, M.B. Anand, et al.
IEEE Topical Meeting EPEPS 2002
G. Arjavalingam, Y. Pastol, et al.
CLEO 1989