Conference paper
CMOS scaling beyond 22 nm node
D.K. Sadana, S.W. Bedell, et al.
ECS Meeting 2009
We report electrical measurements on hexagonal silicon-germanium (hex-SiGe), a group IV alloy with direct bandgap. Electrical contacts are formed by metal alloying and doping is achieved using ion implantation. The metastable hex-SiGe phase is recovered after implantation by solid phase recrystallization. Independent of the metal used, contacts on n-type samples resulted in Schottky barriers due to Fermi level pinning of hex-SiGe. Overall, this constitutes a first step toward use of hex-SiGe for optoelectronic applications.
D.K. Sadana, S.W. Bedell, et al.
ECS Meeting 2009
A. Dimoulas, Y. Panayiotatos, et al.
ECS Meeting 2008
M. Sousa, C. Rossel, et al.
Journal of Applied Physics
S.J. Koester, E.W. Kiewra, et al.
Applied Physics Letters