William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
The effect of reactive ion etching and plasma etching on the electrical properties of boron-doped silicon has been studied, employing junction capacitance measurements on Schottky diodes. Deep-level transient spectroscopy measurements on the treated samples reveal the presence of a number of previously unreported near-surface traps. The depth profiles of the observed traps have been determined, and their annealing behaviour is studied up to 200°C. A tentative association of these traps with strain-induced defects resulting from deuterium platelet formation or with vacancy-related defect complexes is proposed. © 1989.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
H.D. Dulman, R.H. Pantell, et al.
Physical Review B
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials
R. Ghez, M.B. Small
JES