Conference paper
Reliability of Cu interconnects with Ta implant
J.P. Gambino, T.D. Sullivan, et al.
IITC 2007
The 1/f noise of polycrystalline gold films (5 μm wide and 0.5 μm thick) was found to decrease in the presence of hydrogen, to a level comparable with that in a single-crystal gold film. Additionally, hydrogen was found to segregate to the metal-substrate interface. On the basis of these results and recent evidence in the literature, we propose that hydrogen interacting with interface defects is responsible for both the observed 1/f noise decrease and the previously reported electromigration enhancements.
J.P. Gambino, T.D. Sullivan, et al.
IITC 2007
A. Grill, V.V. Patel, et al.
Journal of Applied Physics
M.P. Petkov, C.L. Wang, et al.
Journal of Physical Chemistry B
P. DeHaven, K.P. Rodbell, et al.
MRS Spring Meeting 1999