William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
Paper
Effect of CO on the Low Temperature Diffusion of Cr and Si Through Thin Gold Films
Abstract
Low temperature diffusion of Cr and Si through thin gold films is studied in N2 and in (N2 + CO) ambients. The out-diffusion of both Cr and Si to the gold surface is suppressed in the presence of CO. The results are discussed in terms of a model which considers the roles of both the gold film and the ambients used. © 1980, The Electrochemical Society, Inc. All rights reserved.
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