DETECTION OF LOCALIZED ADHESIVE FAILURE OF METALLIZATION ON NON-CONDUCTING SUBSTRATES USING ELECTROMAGNETIC ULTRASONIC GENERATION.

A noncontact, nondestructive method for detecting local changes in the adhesion of metal foil to a substrate by monitoring the amplitude of resonant modes of the substrate excited electromagnetically is presented. The advantage of electromagnetic excitation is that the generation is confined to the metallized pattern and this technique probes the impedance match between metal film and substrate.