Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperInterface state generation in pFETs with ultra-thin oxide and oxynitride on (100) and (110) Si substratesJ.H. Stathis, R. Bolam, et al.INFOS 2005
PaperFabrication of Si/SiGe quantum point contacts by electron-beam lithography and shallow wet-chemical etchingU. Wieser, U. Kunze, et al.Physica E: Low-Dimensional Systems and Nanostructures