H.D. Dulman, R.H. Pantell, et al.
Physical Review B
The new high temperature superconductors open up possible applications in magnets, power transmission, computer interconnections, Josephson devices and instrumentation, among many others. This paper presents a case study of one of these applications — the use of superconducting interconnects in 77 K CMOS semiconducting chips and packages. Significant leverage vis-a-vis normal metal interconnects at 77 K appears primarily in the packaging (rather than on-chip) and only at high performance (high frequency). As in other applications, this encourages a long-term view of the impact of high temperature superconductivity. © 1988, Elsevier Science Publishers B.V.. All rights reserved.
H.D. Dulman, R.H. Pantell, et al.
Physical Review B
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Shiyi Chen, Daniel Martínez, et al.
Physics of Fluids
Robert W. Keyes
Physical Review B