Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperGrowth instability in diffusion controlled polymerizationJ.H. Kaufman, Owen R. Melroy, et al.Synthetic Metals
PaperFabrication of Si/SiGe quantum point contacts by electron-beam lithography and shallow wet-chemical etchingU. Wieser, U. Kunze, et al.Physica E: Low-Dimensional Systems and Nanostructures