Thomas H. Baum, Carl E. Larson, et al.
Journal of Organometallic Chemistry
A compact modeling approach for silicon-chip slow-wave transmission lines with slotted bottom metal ground planes is studied and its limitations are presented. The modeling approach facilitates the calculation of the slow-wave transmission line parameters based upon the corresponding coplanar and grounded coplanar transmission-line parameters. The described analysis method is used for a comparative study of the slow-wave structures versus their coplanar and grounded coplanar reference structures. Floating bottom shield slow-wave transmission lines are then compared with their grounded bottom shield counterparts. The theoretical results are supported by electromagnetic simulations and by measurements up to 30 and 50 GHz. © 2006 IEEE.
Thomas H. Baum, Carl E. Larson, et al.
Journal of Organometallic Chemistry
Mark W. Dowley
Solid State Communications
Revanth Kodoru, Atanu Saha, et al.
arXiv
F.J. Himpsel, T.A. Jung, et al.
Surface Review and Letters