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A 100°C carbon co-implantation into phosphorus-doped source/drain extensions has been developed, providing for low junction leakage. NFETs made using cold carbon co-implantation and ultra-low energy phosphorus ion implantation showed high activation (Rs∼ 500 ohm/sq) and sub-20 nm depth abrupt N+ junction. © 2011 IEEE.
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VLSI Technology 2020
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