Takeshi Nogami, Tibor Bolom, et al.
IEDM 2010
The (buried) interface between a polycrystalline Al thin-film feature and its substrate (single crystal Si) was characterized with x-ray microdiffraction. Using a focused x-ray beam (effective spot size on the specimen ∼2×12 μm) with the Si 004 reflection, topographic images of the Si around and under the metallization feature were constructed. Comparison with shear-lag model calculations indicate that the interface is not fully coupled despite the absence of surface cracks. © 1998 American Institute of Physics.
Takeshi Nogami, Tibor Bolom, et al.
IEDM 2010
C.E. Murray, I.C. Noyan, et al.
MRS Proceedings 2003
I.C. Noyan, L.T. Nguyen
Polymer Engineering & Science
C.-K. Hu, L. Gignac, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2008