Albert E. Ruehli, Giulio Antonini, et al.
IEEE Trans Electromagn Compat
Paper
Capacitance Models for Integrated Circuit Metallization Wires
Abstract
New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer program for multiconductor geometries. These concepts are applied to the wiring of an integrated circuit chip. Capacitances are found for crossovers, vias, and right angle bends for a realistic geometry. Copyright © 1975 by The Institute of Electrical and Electronics Engineers, Inc.
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