The DX centre
T.N. Morgan
Semiconductor Science and Technology
The amorphous to face-centered cubic (fcc) and fcc to hexagonal close-packed (hcp) crystallization temperatures of GeSbTe thin films on underlying silicon nitride and silicon dioxide films were studied through slow (1 K/min) resistance versus temperature measurements. The amorphous to fcc phase transition is observed at ∼ 170 C for both cases but the fcc to hcp phase transition temperature for GeSbTe films on silicon nitride is observed to be ∼ 80 C lower than for GeSbTe films on silicon dioxide, possibly due to the hexagonal symmetry of silicon nitride. © 2013 Elsevier B.V. All Rights Reserved.
T.N. Morgan
Semiconductor Science and Technology
Shu-Jen Han, Dharmendar Reddy, et al.
ACS Nano
L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
Lawrence Suchow, Norman R. Stemple
JES