S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
The amorphous to face-centered cubic (fcc) and fcc to hexagonal close-packed (hcp) crystallization temperatures of GeSbTe thin films on underlying silicon nitride and silicon dioxide films were studied through slow (1 K/min) resistance versus temperature measurements. The amorphous to fcc phase transition is observed at ∼ 170 C for both cases but the fcc to hcp phase transition temperature for GeSbTe films on silicon nitride is observed to be ∼ 80 C lower than for GeSbTe films on silicon dioxide, possibly due to the hexagonal symmetry of silicon nitride. © 2013 Elsevier B.V. All Rights Reserved.
S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
T.N. Morgan
Semiconductor Science and Technology
William G. Van der Sluys, Alfred P. Sattelberger, et al.
Polyhedron