Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Grain-sizes of more than a millimeter have been achieved in alloyed Al thin films on amorphous SiO2 surfaces, through anomalous or secondary grain growth. Conductors fabricated from these films exhibit extremely long electromigration failure times in comparison to the normal polycrystalline conductors. Analysis of mass transport data during electromigration indicates that lattice diffusion is the dominant transport process in these conductors, with activation energies of 1.22 eV and 1.20 eV for Al transport and Cu transport, respectively. © 1973.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids