Conference paper
Maskless laser plating techniques for microelectronic materials
R.J. Von Gutfeld, M.H. Gelchinski, et al.
Proceedings of SPIE 1989
We describe a new type of jet plating that uses a focused high-frequency sound field directed through the center of the jet. The acoustic jet results in an improved morphology for gold and copper depositions although plating rates are not enhanced. Four-point probe measurements of acoustic-jet plated copper lines show up to a 50% decrease in electrical resistivity compared to jet plated deposits.
R.J. Von Gutfeld, M.H. Gelchinski, et al.
Proceedings of SPIE 1989
D.W. Abraham, T.J. Chainer, et al.
INTERMAG 2003
S.R. Herd, K.Y. Ahn, et al.
Journal of Applied Physics
H.K. Wickramasinghe, Y. Martin
Journal of Applied Physics