O.F. Schirmer, K.W. Blazey, et al.
Physical Review B
Progress in scaling of MOS transistors and integrated circuits over the years is reviewed and today's status and challenges are described. Generalized scaling is updated for the present leakage-constrained environment to project results of continued scaling at a constant power-supply voltage. Alternatives to achieve energy-efficient operation at lower voltages are discussed. Particular attention is given to threshold variability issues and to the design challenges in reducing and controlling variability using back-gate devices. The importance of the depth of the inversion layer below the silicon surface as a limit to the effectiveness of gate-insulator scaling is illustrated by a design study. Low-temperature operation is considered as a possible future direction for continuing scaling. © 2007 Elsevier Ltd. All rights reserved.
O.F. Schirmer, K.W. Blazey, et al.
Physical Review B
K.N. Tu
Materials Science and Engineering: A
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films