09 Feb 1999US5869356Method And Structure For Constraining The Flow Of Encapsulant Applied To An I/c Chip On A Substrate
21 Jul 1998US5784260A Structure For Constraining The Flow Of Encapsulant Applied To An I/c Chip On A Substrate
IBM Safer Materials AdvisorFinding AI-based solutions to address challenges around materials of concern and their replacement.
